Thermal transient test and RTL level emulation system
The Thermal transient test and RTL level emulation system consists of multiple modules joined by an interface frame. Each module is connected to one host workstation by either two 10m (32ft) optical fiber link cables or one 10m (32 ft.) Ethernet link cable. Up to four optional bulkhead IOs (one on each module) can interface with your custom targets. In addition, by configuring a comodel connection, you can run comodel applications to accelerate verification.
| 1 | CX-STD Chassis | CX-STD Chasis |
| 2 | CX-STD System board (mother board) | CX-TMC-2ND-MB V2.0 |
| 3 | CX-STD Power Switching Control Card | CX-PSW DA30V10 V2.0 |
| 4 | CX-STD NTC/PTC Temperature Monitor Card | CX-NPS V2.0 |
| 5 | CX-STD Super high speed data sampling card | CX-DTS V2.0 |
CX-30E10RTL
DIODE mode, SAT mode, IGBT mode, RDSON mode, HEMT mode
Comply with JESD51-1, JESD51-14, IEC 60747-8, IEC 60747-9, IEC 60747-15, IEC 60749-23, IEC 60749-34, AEC-Q101, AQG 324 and other related standards
4x Isolated ouput; -10V ~ 20V with err. < 0.1V + 0.5%.
1nA ~ 850nA; 850nA ~ 1mA;
30A/10V, err. < 0.05A + 0.1%.
±0.1A ~ ±1A @10V
4x ±5V channels, err. < 1mV+0.5%; Dynamic range: 100mV, 200mV, 400mV, 800mV; Dynamic resolution: 16μV; Sampling rate: up to 1MHz.
